Getting the Best from Your X-ray Inspection System
Instructor: Dr. David Bernard, X-ray Consultant for the Electronics Industry
September 9, 2021
11:00 am – 2:00 pm EST
X-ray inspection has been used for many years to find defects and check the manufacturing quality of printed circuit boards and electronic components. Many new and old x-ray inspection systems are in use today, and their functional and imaging capabilities vary widely. Therefore, it is helpful to understand the potential limitations of the specific x-ray system you have. This means you can ensure you use your system in the best way for appropriate investigations (and not for applications it cannot see), extend the x-ray test functionality to more people within the facility, and do this without compromising the analytical effectiveness.
This two-hour seminar will identify and explain the operational parameters of an x-ray inspection system that affect the image quality, available magnification, and image views they can achieve. 2D and 3D x-ray functionality will also be discussed. From this, practical methods, with examples, will be provided to suggest improvements users can make in their x-ray inspection analysis for defect identification and voiding levels within common x-ray-inspected components, such as BGAs, QFNs and connectors, as well as for other failure modes, such as cracks.
This seminar is not commercial and will not promote any specific brand of x-ray equipment.
Who should attend?
This seminar is aimed at those who are new, or relatively new, to x-ray inspection and will also provide a training resource for experienced users who are responsible for the continuing professional development of their colleagues. It will also aid those considering replacement of an existing x-ray system.