Tuning Up Your Stencil Printing Process
Instructor: Chrys Shea
April 14, 2021
1:00 pm – 4:00 pm EST
One of the best ways to increase end-of-line yields is to improve the solder paste printing process. Solder paste deposition is arguably the most critical process on a PCB assembly line, as it lays the foundation for the components to be properly and reliably soldered the circuit board. Overall, the SMT assembly process can be very complex, and while a perfect print may not necessarily mean no rework at the end of the production line, a bad print practically guarantees it ,along with the associated costs of repair or scrap.
This three-hour webinar begins with the basics, introducing common terms and concepts used in the solder paste printing process. It then discusses the physics of printing, to help the attendee visualize what happens inside the printer when the hood is closed and the axes are moving. This knowledge prepares the participant to understand the impacts on their printing process of:
- Proper alignment, gasketing and board support
- Nanocoating stencils
- Selecting foil materials
- QFN stencil design
The webinar closes with a quick and easy troubleshooting strategy to address the most common issues, and a troubleshooting guide for more specific ones.
- Solder paste fill and release from stencil apertures
- Under stencil cleaning effectiveness
- The effect of hot slump on QFN voiding
- The effect of stencil I/O design on QFN voiding
How to Save Up to 25% on Your PCB Purchases
Instructor: Greg Papandrew
May 19, 2021
1:00 pm – 3:00 pm EST
Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar?
What is your company’s PCB buying strategy in this year’s challenging business environment? Do you have one?
Unfortunately, most PCB buyers get no formal training. They have to learn on the job. Sometimes that works. But often, they end up leaving money on the table.
This webinar training program gives buyers the tools they need to do their jobs better.
Companies employing our methods typically save 10 to 25 percent on their PCB purchases.
We will teach buyers how to evaluate the strengths and weaknesses of both offshore and domestic manufacturing sources. We also show them how to leverage buying power to get the best prices, and how to expertly navigate sourcing issues based on order size and technology type.
What PCB Buyers Will Learn
- How to better manage current vendors and assess new vendors.
- How to set service expectations for vendors and implement vendor-managed inventory programs that will meet changing production needs without raising costs.
- How to develop and implement corporate PCB fabrication specifications unique to your organization to ensure consistent quality.
- How to understand the differences between workmanship guidelines (IPC-A-600) and qualification/testing specifications (IPC-6012), and when to employ each.
- How to negotiate better terms and put into place rebate programs so vendors can reward your company’s buying and payment performance.
- How to leverage your company’s annual spend with carefully selected vendors, commanding the best service while also diversifying your vendor base.
- How to confidently move business from one vendor to another, when necessary, ensuring minimal disruption to production schedules.
- How to navigate the strengths and weaknesses of both offshore and domestic manufacturing sources.
Getting the Best from Your X-ray Inspection System
Instructor: Dr. David Bernard, X-ray Consultant for the Electronics Industry
May 20, 2021
1:00 pm – 3:00 pm EST
X-ray inspection has been used for many years to find defects and check the manufacturing quality of printed circuit boards and electronic components. Many new and old x-ray inspection systems are in use today, and their functional and imaging capabilities vary widely. Therefore, it is helpful to understand the potential limitations of the specific x-ray system you have. This means you can ensure you use your system in the best way for appropriate investigations (and not for applications it cannot see), extend the x-ray test functionality to more people within the facility, and do this without compromising the analytical effectiveness.
This two-hour seminar will identify and explain the operational parameters of an x-ray inspection system that affect the image quality, available magnification, and image views they can achieve. 2D and 3D x-ray functionality will also be discussed. From this, practical methods, with examples, will be provided to suggest improvements users can make in their x-ray inspection analysis for defect identification and voiding levels within common x-ray-inspected components, such as BGAs, QFNs and connectors, as well as for other failure modes, such as cracks.
This seminar is not commercial and will not promote any specific brand of x-ray equipment.
Who should attend?
This seminar is aimed at those who are new, or relatively new, to x-ray inspection and will also provide a training resource for experienced users who are responsible for the continuing professional development of their colleagues. It will also aid those considering replacement of an existing x-ray system.