Austin, TX

Hilton Garden Inn Austin Downtown

June 9 – 10, 2020


SMT Assembly Boot Camp

Phil Zarrow

This SMT electronics assembly class is a practical overview of the many different processes and materials used in through-hole and surface mount technologies (SMT). It is a focused, two-day long class, which provides students with the opportunity to learn and understand the processes, tools, and materials used in today’s manufacture of electronic assemblies.

The course combines lecture, videos and discussion and is intended for those that are new to electronics assembly and want to come up to speed on the processes, materials, equipment and procedures.

DAY ONE


PCB Fabrication Overview

  • Circuit board manufacture overview
  • Surface finish
  • Legend

SMT Assembly

  • Solder paste
    • Nomenclature
    • Manufacture
    • Solder characteristics
    • Flux
    • Solder paste considerations
  •  Stencil Fabrication and Design
    • Chemical etch
    • Laser cut
    • Electroplating
    • Aperture design rules
    • Special aperture
  •  Solder Paste Printing
    • Dispensing options
    • Fiducials
    • Solder deposition
    • Process parameters
    • Process considerations

DAY TWO


SMT Assembly

  • Component placement
    • Machine types
    • Feeder types
    • Placement considerations
  • Reflow
    • Reflow oven types
    • Vapor phase
    • Profile development
    • Reflow considerations
  •  Wave Soldering
    • Machine types
    • Profile development
    • Process considerations
  • Selective Soldering
    • Machine types
    • Profile development
    • Process considerations
  •  Cleaning
    • Contaminants and corresponding solvents
    • Effectiveness of aqueous detergents
    • Cleaning equipment (batch and inline systems)
    • Cleanability of Components
    • Driving forces for no-clean
    • Cleaning no-clean
  • Testing
    • Testing and controlling the process through SPC
    • Inspection points and strategies in the process
    • AOI
    • X-ray
    • Testing considerations

Austin, TX

Hilton Garden Inn Austin Downtown

June 11 – 12, 2020


Design Essentials for the PCB Engineer

Susy Webb

Sponsored by:EMA

Engineers designing their own boards will need to understand and use the same science that seasoned PCB designers have built up over many years. For example, the way parts are built, or a board is designed, can make a huge impact on the ease of fabrication and assembly, just by the practices put into place while working. Those practices can increase yields and lower the cost for all, and this two-day workshop starts with thoughts about that. There are many ways to place parts on a board, but some work much better than others for the physics, electrical and mechanical purposes. We will discuss the order of placing parts, setting up routing, and placement ideas that will lead to better flow.

On Day 2, fine-pitch BGAs will be examined. Their size and pitch make them increasingly challenging to work with, as do the signal integrity and EMI issues that come along with them. We will look at through-hole and HDI examples for fanout, grid and routing information, and their specific manufacturing needs. In the last section we will delve more into the science of how everything works together by discussing the electronics and physics, controlling impedance and high-frequency energy, and stack-up and power issues. There will be examples of how a signal’s field energy actually flows through layers of the board, and steps to take when routing signals through the board. The workshop will conclude with a brief discussion of autorouting vs. hand routing.

DAY ONE


Best DFM Practices

  • Best practices for parts – why this is so important
  • The reasoning behind component mounting
  • Understanding the consequences
  • Building workable padstacks and footprints
  • Placing parts for manufacturability
  • Routing practices that are helpful
  • Material and stack-up information from manufacturing point of view
  • Specific DfM and DfT issues
  • DfM for BGAs
  • Documentation that is complete and understandable
  • Calculators and tools

Part Placement Choices

  • Choosing effective parts
  • Groups and constraints from schematic to PCB
  • Placement concepts
  • Approximate order of placement
  • Detailed placement issues
  • Placement to set up routing and channels
  • Trace routing schemes
  • Termination placement guidelines
  • Fine points of placement

DAY TWO


Complexities of Fine-Pitch BGA Design

  • What to look for in a BGA
  • BGA pad and via structure
  • Placement and layer count for BGAs
  • Through-hole fanout and grid examples
  • Planning and possibilities for using HDI in BGAs
  • Benefits of HDI/microvias
  • HDI fanout and grid examples
  • Grids and routing outside the BGAs
  • Capacitance and power for BGAs
  • Manufacturing issues specific for BGAs

Advanced Issues for Designing Boards

  • How electronics and physics relate to design
  • Impedance control
  • Spacing and crosstalk
  • Layer paired routing and return
  • Parts placement for signal integrity and EMI control
  • Routing for signal integrity and EMI control
  • Power distribution
  • Signals flow from layer to layer
  • Autorouting vs. hand routing