A Guide to Engineering PCB Design

 

Susy Webb, CID

 February 23, 2021

Part One: 10:00 am – 1:00 pm EST

Part Two: 2:00 pm – 6:00 pm EST

 

Available on demand for live registrants only.

This class will feature an overview of the processes of board design from an engineering perspective. To begin, we will have a conversation about how the electronics and physics are involved and why controlling rise time, field energy, and transmission lines are extremely important to the signals on the board. Placement will be discussed next, with order, flow, and setting up potential routing being some of those topics. The planes and stack-up structure will play a major role in the quality of the design and impedance control, especially if the design is high speed, and plane and capacitor placement are a large part of power distribution, as well. The way signals are routed and how their return current is set up is critical their performance. We will discuss fanouts, using grids, the signal flow from layer to layer, layer paired routing and spacing. HDI technology is a huge benefit to dense boards, fine pitch parts, and BGAs so we will go over their setup and routing, as well. All these topics will include information on signal integrity, EMI and impedance control, to make a board that works well from the beginning. Many aspects of making a board manufacturable also help to make it less expensive, so an examination of that will wrap the technical things up, followed by information on the pros and cons of hand routing vs auto routing and the quality of board that is possible with that. 

Target audience: Design engineer, PCB designer

Level: Beginner, intermediate

$150 webinar fee, non-refundable

Professional Development Certificate included!

Group discount for 5 or more.  Contact Alyson Corey, acorey@upmediagroup.com for more information.

Sponsored by:

 

register now

Tuning Up Your Stencil Printing Process

 

Chris Shea

March 2, 2021

1:00 pm – 4:00 pm EST

 

Available on demand for live registrants only.

One of the best ways to increase end-of-line yields is to improve the solder paste printing process.  Solder paste deposition is arguably the most critical process on a PCB assembly line, as it lays the foundation for the components to be properly and reliably soldered the circuit board.  Overall, the SMT assembly process can be very complex, and while a perfect print may not necessarily mean no rework at the end of the production line, a bad print practically guarantees it ,along with the associated costs of repair or scrap.

This three-hour webinar begins with the basics, introducing common terms and concepts used in the solder paste printing process.  It then discusses the physics of printing, to help the attendee visualize what happens inside the printer when the hood is closed and the axes are moving.  This knowledge prepares the participant to understand the impacts on their printing process of:

  • Proper alignment, gasketing and board support
  • Nanocoating stencils
  • Selecting foil materials
  • Underwiping
  • QFN stencil design

The webinar closes with a quick and easy troubleshooting strategy to address the most common issues, and a troubleshooting guide for more specific ones.

Videos include:

  • Solder paste fill and release from stencil apertures
  • Under stencil cleaning effectiveness
  • The effect of hot slump on QFN voiding
  • The effect of stencil I/O design on QFN voiding

 

$95 webinar fee, non-refundable

Professional Development Certificate included!

Group discount for 5 or more.  Contact Alyson Corey, acorey@upmediagroup.com for more information.

Sponsored by:

 

register now