About

Control of Noise, EMI and Signal Integrity in
High Speed Circuits and PCBs

8:30 am to 5:00 pm each day

Rick Hartley – RHartley Enterprises

(Formerly L-3 Avionics Systems – retired)

$595 per city

The Issue

When time-varying signals travel in the transmission lines of a printed circuit board, state changing electric and magnetic fields are present. When not contained, these fields are the energy source of noise, EMI and signal integrity issues. “Noise” is “intentional energy” which we fail to contain. Uncontrolled energy generates many forms of interference. Some circuits are noisy, while others are not? With the right training the reasons are easily understood!Compounding the problem are today’s extremely fast ICs. A circuit with 200 ps rise time devices can generate serious problems whether clocked at 2MHz, 200MHz or 2GHz.

Training that Works

Knowing how to design PCBs and enclosures to contain fields and control the effects of high speed devices are the keys to successful design of low noise circuits. This two-day workshop – completely updated over the past two years – is a crisp focus of the issues PCB designers and engineers need to know to prevent EMI, signal integrity, crosstalk and grounding problems in high speed digital and mixed signal designs. Topics include:
Day 1
  • Impact of frequency on PCB layout
  • Frequency – analog vs. digital
  • Lumped vs. distributed length lines
  • Basic essentials of grounding
  • Noise – what is it and why it occurs
  • Where energy travels in circuits
  • Transmission lines and return current paths
  • Critical Importance of proper plane assignment
  • Common misuse of planes
  • Routing and reflections
  • Propagation time and velocity
  • Impact of nearby traces on impedance
  • Importance of reflection mode switching
  • New thoughts on line termination
  • Impact of long Ts in transmission lines
  • Proper DDR routing
  • Vcc and ground bounce
  • Cross talk … what is it … exactly
  • Differential pair basics
  • Differential impedance … what really matters
  • Differential pair cross talk
  • Differential pair length matching and skew issues
Day 2
  • Basic types of EMI
  • Antenna basics and radiators in systems
  • Keys to controlling common mode energy
  • Component placement impact on EMI
  • Ground- To Split or not to Split
  • Extreme Importance of I/O connector placement
  • Impact of connector pin assignments
  • Board routing to control EMI and noise
  • Power distribution and decoupling
  • IC impact on power system noise
  • Decoupling boards without power planes
  • Decoupling conventional 4-layer boards
  • Decoupling high layer count boards
  • Impact of via and plane inductance
  • Analog IC decoupling
  • Ferrites in the power bus
  • Extreme importance of PCB stack-up
  • PCB stack-ups that work for SI and EMI control
  • I/O filtering- Low and high frequency
  • I/O setup- Metal vs. plastic enclosures
  • Slots and openings in enclosures
  • Proper shielding of cables, low and high frequency
  • How many cables inside the system?
  • Routing of internal and external cables
  • Heatsinks and EMI
  • Using chassis as a heatsink.
  • Switch Mode Power Supplies – Layout to control EMI

Each attendee will receive a color PDF of the overheads, as well as a reduced set for printing, both of which can be utilized for note taking and future reference.

About the Instructor

Rick Hartley (retired from L-3 Avionics) is the principal of RHartley Enterprises, through which he consults and teaches internationally to resolve noise, signal integrity and EMI issues. Rick has helped major corporations in the US and 12 other countries. His 51-year career focused on circuits and PCBs for the telecom, computer and aircraft avionic worlds. Rick’s consulting focuses on those same industries, as well as the automotive and appliances. He has dedicated the past 41 years to development of PCB and circuits with specific emphasis on control of noise, EMI & SI in the digital, analog and RF domains. Rick has taught at IEEE events, is a member of the IPC Designers Council Executive Board, serves on several IPC subcommittees and is a past member of the Editorial Review Board of Printed Circuit Design Magazine. He has also written numerous technical papers and articles on methods to control noise, EMI and signal integrity.